TSMC (TSM) Stock: Record Q3 Revenue and a Packaging Price Hike Report
Photo: CoinCentral
TLDR TSMC is reportedly set to raise prices for CoWoS advanced chip packaging by 10% to 20%, per the Commercial Times. AI demand is spreading from GPUs to server CPUs and custom chips, tightening packaging capacity. Equipment delivery times have stretched to six to eight months, up from three to six. Q3 revenue hit a record NT$1.494 trillion, up 41.2% from a year earlier. TipRanks shows a Strong Buy consensus on TSM, with nine Buys and one Sell. TSMC (TSM) stock slipped 0.39% on Tuesday, while its Taiwan listing (2330) rose 0.63%.
Source: CoinCentral
