TSMC reportedly weighs CoWoS price hikes of up to 20% as AI packaging stays scarce
Photo: Crypto Briefing
The chipmaker's advanced packaging service remains a bottleneck for AI accelerators, and customers may soon pay more for it TSMC is reportedly considering raising prices on its CoWoS advanced packaging services by up to 20%. CoWoS, short for Chip on Wafer on Substrate, is the stage that holds the band together. It places multiple chips side by side on a silicon interposer, a thin layer packed with fine connections, which then sits on a substrate. It lets separate chips behave like one giant chip.
Source: Crypto Briefing
