Samsung Prepares HBM4E Cooling for Larger AI Interposers

Samsung Electronics is preparing multiple cooling technologies for next-generation high-bandwidth memory as AI packages place more compute chiplets and memory stacks on single interposers. Interposers connecting processors with HBM could expand from about 5.5 times the 858-square-millimeter maximum exposure area of an extreme ultraviolet lithography tool to roughly 40 times that size. The larger structures are increasing the need for more effective heat management. The projected growth reflects limits on process scaling and the wider use of chiplet-based 2.5D packaging.

Source: TokenPost