Malaysia unveils six homegrown chips in push beyond assembly lines
Photo: Crypto Briefing
The country showcased designs for AI, automotive, satellite and drone uses as it tries to move up the semiconductor value chain Malaysia has spent roughly half a century putting other people’s chips together. Now it wants its name on the blueprint. On October 16, 2026, the country showcased six semiconductor chips at the Selangor AI & Semiconductor Summit. All six were developed by companies based in the Malaysia Semiconductor IC Design Park. They are part of a deliberate effort to shift from assembly and packaging toward chip design and intellectual property ownership.
Source: Crypto Briefing
