Taiwan Chipmaker Approves NT$73.16 Billion Kaohsiung Fab Expansion
Photo: TokenPost
Taiwanese chipmaker 華邦電 (2344) approved NT$73.163 billion for Phase II, Module B, at its Kaohsiung 12-inch wafer facility, while General Manager 陳沛銘 expects memory supply and demand to be relatively tight in 2027 and 2028. The capital spending covers factory construction, facility systems, production equipment and capitalized lease assets. The company expects to invest in stages starting in November 2026, using company funds and bank financing. Demand for high-bandwidth memory (HBM) and DDR5 in AI servers is rising. Major memory producers are shifting capacity toward HBM, whose production uses limited advanced wafer capacity.
Source: TokenPost
