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Samsung ships 12-layer HBM4 to Nvidia in February; 8-layer variants planned for 2027

Samsung ships 12-layer HBM4 to Nvidia in February; 8-layer variants planned for 2027

Photo: Crypto Briefing

The two Korean memory giants are lining up shorter HBM4 stacks for Nvidia as the race to feed its next AI chips heats up Samsung and SK hynix plan to ship 8-layer HBM4 memory to Nvidia in February. That puts both of South Korea’s memory heavyweights on the same delivery calendar for the world’s most demanding chip customer. High-bandwidth memory, or HBM, is DRAM stacked vertically and placed right beside a processor. The “layers” are the floors in that building.

Source: Crypto Briefing

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