Samsung and AMD Demonstrate CXL Memory Pooling at OCP Summit
Photo: TokenPost
Samsung Electronics and AMD demonstrated a Compute Express Link (CXL) memory expansion system at OCP Global Summit 2026, showing how multiple systems can share memory and expand capacity for artificial intelligence workloads. The demonstration used Samsung’s CMM-D memory-pooling technology. The companies did not disclose performance figures, customer names or a commercialization timeline. Samsung also displayed HBM5, customized high-bandwidth memory, zHBM and processing-in-memory technology. Its storage lineup included QLC NAND and Flexible Data Placement (FDP) SSD technology, alongside demonstrations of key-value cache optimization and Direct Storage for AI systems.
Source: TokenPost
