川湖科技 Plans NT$10 Billion Bond Sale for Factory Expansion
Photo: TokenPost
川湖科技 (2059) plans to raise up to NT$10 billion through two five-year convertible bond offerings to fund an investment in subsidiary 川益科技 for new factories and equipment amid customer demand for server rails. The investment would support construction of 川益科技’s third and fifth factories and the purchase of equipment. The estimated value of the factory construction contracts is about NT$11.733 billion. The third bond offering is capped at NT$9 billion and would be placed through bookbuilding. The fourth is capped at NT$1 billion and would be sold by public auction, with a reserve price of 105% of face value.
Source: TokenPost
