NVIDIA and Amkor Plan Over 300% Rise in South Korean Interposer Capacity
Photo: TokenPost
NVIDIA and Amkor Technology plan to expand interposer wafer capacity in South Korea by more than 300%, targeting a production constraint for AI chips. In advanced chip packages, interposers make dense connections between processors and high-bandwidth memory. The target applies to interposer wafers, not to all packaging capacity. The additional capacity has yet to come online. Amkor's new $1.3 billion agreement with NVIDIA will support the South Korean expansion. The companies announced a $1.5 billion multiyear agreement in July to develop packaging technology and expand Amkor's capacity in Arizona. That earlier deal gives the partnership a U.S. manufacturing component.
Source: TokenPost
