EMC Could Gain Share in ABF Substrate CCL Market From Second Half of 2026

Taiwan-based EMC could begin gaining share in the ABF substrate copper-clad laminate (CCL) market in the second half of 2026 as customers accelerate qualification of new suppliers in a segment long dominated by Japanese manufacturers. Japanese suppliers have held more than 95% of the market for ABF CCL, low-dielectric T-glass and ultra-thin copper foil for more than a decade. Capacity expansion by Japanese makers has lagged demand. Use of ABF substrate materials has doubled every one to two years as substrates grow larger and add layers; lower production yields also increase the material needed for each usable unit.

Source: TokenPost