DayOne Data Centers in early talks for a potential $500 million bond

The Singapore-based operator is weighing new debt while it also pursues a US IPO of up to $5 billion DayOne Data Centers is in early discussions with banks about a potential $500 million bond offering. The company is already juggling an IPO filing, a giant loan package and a fresh Series C round, so this would be another line on its funding list. Citigroup is the lead arranger on the potential bond, and the issuance could be finalized as early as 2027. The proceeds would support DayOne’s expansion efforts. The bond conversations sit alongside a much larger debt effort.

Source: Crypto Briefing