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Broadcom and Intel CEOs say capital, not chips, is AI’s next bottleneck

Broadcom and Intel CEOs say capital, not chips, is AI’s next bottleneck

Photo: Crypto Briefing

Hock Tan and Lip-Bu Tan told a Singapore conference that financing costs could slow the AI infrastructure buildout more than hardware shortages For the past few years, the AI buildout story has been about scarcity. Not enough chips, not enough memory, not enough power to plug it all into. Now the CEOs of Broadcom and Intel say the shortage that matters most is money. Speaking at the DBS Asia Future Forward Conference in Singapore on October 12, 2026, Broadcom CEO Hock Tan and Intel CEO Lip-Bu Tan warned that the rising cost of capital could become the biggest constraint on…

Source: Crypto Briefing

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